Specific Process Knowledge/Thin film deposition/Electroplating-Ni

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Technotrans microform.200

The Technotrans microform.200 (Electroplating-Ni in LabManager) is a machine capable of depositing nickel electrochemically. This is done by lowering the sample into an electrolyte containing nickel ions and the apply a voltage across the sample and the anode. The anode is a basket filled with nickel pellets. The cathode is the sample to be coated with nickel.


The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:

Electroplating-Ni positioned in cleanroom 1

LabManager

Process information

Equipment performance and process related parameters

Equipment Equipment 1
Purpose
  • Purpose 1
  • Purpose 2
Performance Response 1
  • Performance range 1
  • Performance range 2
Response 2
  • Performance range
Process parameter range Parameter 1
  • Range
Parameter 2
  • Range
Substrates Batch size
  • # 50 mm wafer
  • # 100 mm wafer
  • # 150 mm wafer
Allowed materials
  • Allowed material 1
  • Allowed material 2