Specific Process Knowledge/Thin film deposition/Deposition of Nickel
Feedback to this page: click here
Nickel deposition
Nickel can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
E-beam evaporation (Alcatel) | E-beam evaporation (Wordentec) | E-beam evaporation (PVD co-sputter/evaporation) | Electroplating (Electroplating-Ni/electrochemical deposition) | |
---|---|---|---|---|
Batch size |
|
|
|
|
Pre-clean | RF Ar clean | RF Ar clean | RF Ar clean | None |
Layer thickness | 10Å to 1µm | 10Å to 1 µm | 10Å to 1000 Å | A few µm to 1400 µm |
Deposition rate | 2Å/s to 15Å/s | 10Å/s to 15Å/s | About 1Å/s | About 1 to 200Å/s |
Comment | Only very thin layers (up to 100nm). | Sample must be compatible with plating bath. Seed metal necessary. |