Specific Process Knowledge/Back-end processing/Die Bonder
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Die bonder (eutectic metal soldering)
The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.
The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:
Process information
Flip-chip bonder (glue attachment)
Equipment | Die bonder | Flip-chip bonder | |
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Performance |
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Substrates | Allowed materials |
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