Specific Process Knowledge/Thin film deposition/Deposition of Germanium

From LabAdviser

Feedback to this page: click here


Deposition of Germanium

Germanium can be deposited by thermal evaporation.


Thermal evaporation (Wordentec)
Batch size
  • 24x2" wafers or
  • 6x4" wafers or
  • 6x6" wafers
Pre-clean RF Ar clean
Layer thickness 10Å to about 2000Å
Deposition rate From 0.4 Å/s up to about ~2Å/s
Comment Recommended for unexposed e-beam resist
Allowed substrates
  • Silicon wafers
  • Quartz wafers
  • Pyrex wafers
Allowed materials
  • Silicon oxide
  • Silicon (oxy)nitride
  • Photoresist
  • PMMA
  • Mylar
  • SU-8
  • Metals
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Germanium&oldid=9741"