Specific Process Knowledge/Thin film deposition/Deposition of Silicon

From LabAdviser

PolySilicon can be sputtered in Alcatel and be deposited in the PolySilicon furnace.In the chart below you can compare the two different deposition methodes:


Sputter (Alcatel) Furnace PolySi
Batch size
  • Up to 1x4" wafers
  • smaller pieces
Pre-clean RF Ar clean
Layer thickness 10Å to 1µm
Deposition rate 2Å/s to 15Å/s
Process temperature 560 oC and 620 oC
Step coverage
Film quality
Substrate material allowed
Doping facility None Can be doped during deposition with Boron and/or Phosphorous


Sputtered Silicon in the Alcatel

The parameter(s) changed New value(s) Deposition rate
Standard parameters None
Power 400W 3.8 Å/s