Specific Process Knowledge/Etch/Etching of Platinum

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Etching of Platinum

Etching of Platinum can be done either by wet etch or by sputtering with ions.


Comparison of Gold Etch Methods

Au wet etch 1 Au wet etch 2 IBE (Ionfab300+)
Generel description Wet etch of Au using Iodine based chemistry Wet etch of Au using Aqua Regina Sputtering of Au - pure physical etch
Etch rate range
  • ~100nm/min
  • ~?nm/min - fast etch
  • ~55nm/min (acceptance test)
Etch profile
  • Isotropic
  • Isotropic
  • Anisotropic (angles sidewalls, typical around 70 dg)
Masking material
  • Photoresist
  • None (only used for stipping Au)
  • Any material that is allowed in the chamber, photoresists included
Substrate size
  • Any size and number that can go inside the beaker in use
  • Any size and number that can go inside the beaker in use

Smaller pieces glued to carrier wafer

  • #1 50mm wafer
  • #1 100mm wafer
  • #1 150mm wafer
  • #1 200mm wafer
Allowed materials

No restrictions cross contamination wise as long as you use the right beaker and make sure that they are safe to enter in the chemicals

No restrictions cross contamination wise as long as you use the right beaker and make sure that they are safe to enter in the chemicals

  • Silicon
  • Silicon oxides
  • Silicon nitrides
  • Metals from the +list
  • Metals from the -list
  • Alloys from the above list
  • Stainless steel
  • Glass
  • III-V materials
  • Resists
  • Polymers
  • Capton tape