Specific Process Knowledge/Thin film deposition/Deposition of Molybdenum

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Molybdenum deposition

Molybdenum can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment. In PVD co-sputter/evaporation only VERY thin layers of Mo can be deposited.

	E-beam evaporation (Alcatel)	E-beam evaporation (PVD co-sputter/evaporation)
Batch size	Up to 1x4" wafers smaller pieces	12x2" wafers or 12x4" wafers or 4x6" wafers
Pre-clean	RF Ar clean	RF Ar clean
Layer thickness	10Å to 0.5 µm	10Å to 500 Å
Deposition rate	2Å/s to 15Å/s	About 1 Å/s
Allowed materials	Silicon Silicon oxide Silicon (oxy)nitride Photoresist PMMA Mylar SU-8 Metals	Silicon Silicon oxide Silicon nitride Silicon (oxy)nitride Photoresist PMMA Mylar SU-8
Comment		Only very thin layers (up to 100nm).