Specific Process Knowledge/Thermal Process/BCB Curing Oven

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BCB Curing Oven

The BCB Curing Oven is mainly used for curing of BCB (bisbenzocyclobutene) and for alloying of metals in a nitrogen atmosphere.

During processing the furnace is rapidly heated by use of five halogen lamps situated below the sample. The furnace is purged with a high or a low nitrogen flow. Samples are processed at atmospheric pressure or at vacuum.

The user manual, user APV, technical information and contact information can be found in LabManager:

The BCB Curing Oven. Located in the III-V Lab

BCB Curing Oven

Process information

There are no standard processes on the furnace.

Equipment performance and process related parameters

Equipment BCB Curing Oven
Purpose
  • BCB curing and metal alloying
Process parameter range Temperature
  • 0 - 450oC
Nitrogen flows
  • Low N2 flow: 5 SLM
  • High N2 flow: Max 16.7 SLM
Substrates Batch size
  • Several small samples (placed on a carrier wafer)
  • One 50 mm wafer (placed on a carrier wafers)
  • One 100 mm wafer
Allowed materials

Use the right carrier wafer

  • BCB
  • III-V materials
  • Co-polymer
  • Silicon, silicon oxide, silicon nitride
  • Quartz
  • Resist (prebaked)
  • Metal (only Al, Ni, Ge and Au)