Specific Process Knowledge/Thin film deposition/Deposition of Tungsten
Tungsten (W) can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
E-beam evaporation (Alcatel) | E-beam evaporation (Leybold) | |
---|---|---|
Batch size |
|
|
Pre-clean | RF Ar clean | Ar ion bombartment |
Layer thickness | 10Å to 1µm | 10Å to 1000Å |
Deposition rate | 2Å/s to 15Å/s | 1Å/s to 5Å/s |