Specific Process Knowledge/Thin film deposition/Deposition of Copper

From LabAdviser

Copper can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.


E-beam evaporation (Alcatel) Sputter deposition (PVD co-sputter/evaporation)
Batch size
  • Up to 1x4" wafers
  • smaller pieces
  • 4x6" wafers or
  • 4x4" wafers or
  • 4x2" wafers
Pre-clean RF Ar clean

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Layer thickness 10Å to 0.5µm

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Deposition rate 2Å/s to 15Å/s

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Studies of Cu deposition processes

Roughness of Cu layers - Roughness of Cu layers deposited with Alcatel

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