Specific Process Knowledge/Characterization/Profiler/Optical Profiler (Sensofar) acceptance test
Results from the Optical Profiler (Sensofar) acceptance test
The acceptance test was performed in January 2012 by STInstruments and Sensofar together with Pernille V. Larsen @ Danchip and Berit G. Herstrøm @ Danchip.
This Table shows the accpetance criteria
' | Title | Sample description / measurement | Acceptance criteria |
1 | Patterned flat sample of silicon | Sample material: Patterned silicon substrate. | Depth 100±2 µm |
Trench depth with aspect ratio 1:10 on a 10 µm wide trench | |||
2 | Patterned flat sample of silicon. | Sample material: Patterned silicon substrate. | Depth 91±2 µm |
Trench depth with aspect ratio 1:11 on a 8 µm wide trench | |||
3 | Patterned flat sample of silicon | Sample material: Patterned silicon substrate | Depth 85±2 µm |
Trench depth with aspect ratio 1:13 on a 6.4 µm wide trench | |||
4 | Patterned flat sample of glass | 3D profile of pattern etched down in a quartz sample. | Depth within ±1% from a standard profiler measurement and repeatability (3 successive measurements) within 0.1% |
Pattern size 20 µm x 20 µm, depth 500 nm | |||
5 | Flat sample of silicon with thick patterned oxide | Step height of patterned thick (10 µm) oxide on top of a silicon wafer. | Step height must be within ±3% of a SEM profile measurement. |
7 µm deep pattern, trench width 6 µm | |||
6 | Flat sample of silicon with thick layer of patterned polymer | Sample material: SU8 on silicon. | Height 69±2 µm |
Pillar heights of 69 µm with 25 µm between pillar edges | |||
7 | Free standing structure | Measure bow due to stress of a membrane. | Membrane bow repeatability of 5 successive measurement within 2% |
Membrane material: Si(2 µm)/SiO2(~1 µm)/Au(50 nm). | |||
Membrane size: honey comb structure approximately 150 µm in diameter. | |||
Bow < 500 nm | |||
8 | Stitching of large area | Stitching 4 mm x 4 mm on same sample as in 7. The area consists of many closed packed honey comb formed membranes. | Membrane bow must the same as on 7 within 2% |
9 | Narrow trenches and holes | Sample material: Patterned silicon substrate. | Depth 20±2 µm |
2.5 µm wide trench in silicon with a depth of 20 µm | |||
10 | Film thickness measurement of transparent thin film | Transparent thin film thickness of 28 nm SiO2 on Si | SiO2 thickness 28±1 nm |
11 | Measurements of multiple stacks | 120 nm nitride on 110 nm oxide on a silicon substrate | Within ±2% on each layer from an ellipsometer measurement. |
12 | Film thickness measurements of transparent films on small structure | Sample material: Si with 1.5 µm patterned AZ-resist | Within ±1% from a standard profiler measurement. |
Measure thickness of AZ-resist on pillars of 50 µm in diameter | |||
13 | Roughness repeatability | Sample material: Si wafer with poly-silicon layer. | Repeatability within 0.2% |
3 successive measurements of the roughness |