Specific Process Knowledge/Characterization/XPS
XPS
See more about elemental analysis on the side Element analysis
A rough overview of XPS-ThermoScientific characteristics
Purpose | Chemical analysis |
|
---|---|---|
Performance | Spot size | Can be set between 30µm - 400µm |
Probing depth | Depending on probed element. Max probe depth lies within 10-200 Å. | |
Resolution | Dependent on probed elements. Concentrations down to about 0,5 atomic % can in some cases be detected. | |
Charge compensation |
Flood gun can be used for charge compensation of non conductive samples | |
Depth profiling | Purpose | With ion beam etch the top layer of the material can be removed, to do a depth profiling |
Ion beam size | About 0,5x1 mm | |
Substrates | Substrate size |
Max 60x60 mm |
Substrate thickness |
Max height about 20 mm |