Specific Process Knowledge/Back-end processing/Wire Bonder

Feedback to this page: click here

TPT Wire Bonder

The TPT Wire Bonder is a new machine bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder.

The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:

Error creating thumbnail: File missing

TPT Wire Bonder, Packlab, Building 347, 2nd floor

Wire bondings: Left: wedge bonding - Right: ball bonding

TPT Wire Bonder

Equipment performance and process related parameters

Equipment		TPT Wire Bonder	Ball Wire Bonder
Purpose		Al and Au 25µm wire bonding Wedge and ball wire bonding Au ribbon (100x20µm) bonding (we have tools and wire but it has not been tested)	Au 25µm wire bonding Ball wire bonding
Performance		Manual operation Wedge bonding: recommended min. bonding area 200 µm Ball bonding: recommended min. bonding area 300 µm recommended temperature 120 oC.	Semi-automatic and manual operation Bond placement laser pointer recommended min. bonding area 100 µm recommended temperature 120 oC.
Substrates	Allowed materials	Should be able to withstand the wire bonding temperature Typical materials are: Alumina (Al2O3), AluminumNitride (AlN), std. circuit boards (FR4)