Specific Process Knowledge/Thin film deposition/Deposition of Gold

From LabAdviser
4th Level - Comparison

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Gold can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.


E-beam evaporation (Alcatel) E-beam evaporation (Wordentec) Sputter (Lesker)
Batch size
  • Up to 1x4" wafers
  • smaller pieces
  • 24x2" wafers or
  • 6x4" wafers or
  • 6x6" wafers
  • up to 1x6" wafer
Pre-clean RF Ar clean RF Ar clean RF Ar clean
Layer thickness 10 Å to 5000Å 10 Å to 5000Å 10 Å to
Deposition rate 2 Å/s to 15 Å/s 1 Å/s to 15 Å/s


Adhesion of Au on Si

Adhesion of Au layers


Studies of Au deposition processes

Roughness of Au layers - Roughness of Au layers deposited with different equipment and settings