Specific Process Knowledge/Wafer cleaning/Post CMP Cleaner

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Post CMP Cleaner)

The Post CMP CLeaner in cleanroom A-5

The post CMP Cleaner is designed for removing slurry residues from polishing wafers. The Post CMP cleaner is the recommended cleaning tool after using the Polisher CMP.


The user manual, user APV, technical information and contact information can be found in LabManager:

The Post CMP Cleaner in LabManager

Equipment performance and process related parameters

Equipment Post CMP Cleaner
Purpose

Cleaning of

  • Samples from the CMP
Process parameter range
Mechanical Cleaning
  • Brush Cleaning
Power
  • Megasonic Power from 0-40 W (in water)
Arm sweep
  • 4" and 6" (20x20mm and 2" run with a 4" sweep)
Substrates Sample size
  • one 20x20mm piece
  • one 50 mm wafer
  • one 2" wafer
  • one 100 mm wafer
  • one 150 mm wafer
Allowed materials
  • Silicon
  • Polysilicon
  • Silicon Oxide
  • Glass/Quartz


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