Specific Process Knowledge/Wafer cleaning/Post CMP Cleaner

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Post CMP Cleaner)

The Post CMP CLeaner in cleanroom A-5

The post CMP Cleaner is designed for removing slurry residues from polishing wafers. After the Post CMP cleaner is the recommended cleaning tool after using the Polisher CMP.

The user manual, user APV, technical information and contact information can be found in LabManager:

The Post CMP Cleaner in LabManager

Equipment performance and process related parameters

Equipment		Polisher/Lapper
Purpose	Polishing of	Silicon SiO2
Performance	20x20mm substrate	Removal rate: 400nm/min Thickness accuracy: +/- ? µm Thickness homogeneity: +/- ? µm Roughness: +/- ? µm
	100mm substrate	Removal rate: ~ 60 nm/min Thickness accuracy: ? µm Thickness homogeneity: ? µm Roughness: +/- ? µm
Process parameter range	Polishing liquid	SF1 Polishing Fluid
	Polishing cloths	Chemcloth Polishing Cloths
	Rotation	Plate Head/Puck
	Arm sweep	Polishing: 20% (inner) - 100% (outer)
Substrates	Sample size	one 20x20mm piece one 50 mm wafer one 2" wafer one 100 mm wafer one 150 mm wafer
	Allowed materials	Silicon Glass/Quartz