Specific Process Knowledge/Back-end processing/LatticeAxe
| Equipment | Wafer scriber | |
|---|---|---|
| Purpose | Cleaving samples in smaller pieces | |
| Performance | Scribe lines | Lines can be made perpendicular to each other by turning chuck 90° |
| Process parameter range | Wafer thickness | Adjustable by increasing or decreasing the load of the diamond pen |
| Distance between scribe lines | Approx. 5 mm | |
| Substrates | Size of Substrate | Up to 100 mm wafers |
| Allowed materials | All but only Si where the scribe lines are made
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