Specific Process Knowledge/Thin film deposition/Deposition of Silver

Silver can be deposited by e-beam or thermal evaporation. In the chart below you can compare the different deposition equipment.

	E-beam evaporation (Alcatel)	E-beam evaporation (Leybold)	Thermal evaporation (Wordentec)
Batch size	Up to 1x4" wafers smaller pieces	8x4" wafers or 5x6" wafers	6x6" wafers or 6x4" wafers or 24x2" wafers or
Pre-clean	RF Ar clean	Ar ion bombartment	RF Ar clean
Layer thickness	10Å to 1µm	10Å to 0.5µm	10Å to 0.5µm (0.5µm not on all wafers)
Deposition rate	2Å/s to 15Å/s	1Å/s to 5Å/s	1Å to 10 Å/s

Thermal deposition of Silver - Process settings for thermal deposition of Silver in Wordentec