Specific Process Knowledge/Thin film deposition/Deposition of Platinum

From LabAdviser

Feedback to this page: click here


Platinum deposition

Platinum can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment.


E-beam evaporation (Temescal) E-beam evaporation (Wordentec) Sputter deposition (Lesker)
General description E-beam deposition of Pt E-beam deposition of Pt Sputter deposition of Pt
Pre-clean Ar ion source RF Ar clean RF Ar clean
Layer thickness 10Å - 1µm* 10Å to 5000Å* 10Å to 5000Å
Deposition rate 0.5Å/s to 10Å/s 10Å/s to 15Å/s ? Å/s to ? Å/s
Batch size
  • Up to 4x6" wafers
  • Up to 3x8" wafers (ask for holder)
  • smaller wafers and pieces
  • 24x2" wafers or
  • 6x4" wafers or
  • 6x6" wafers
  • 1x4" wafer or
  • 1x6" wafer
  • smaller pieces
Allowed materials
  • Silicon
  • Silicon oxide
  • Silicon (oxy)nitride
  • Photoresist
  • PMMA
  • Mylar
  • SU-8
  • Metals
  • Silicon
  • Silicon oxide
  • Silicon nitride
  • Silicon (oxy)nitride
  • Photoresist
  • PMMA
  • Mylar
  • SU-8
  • Metals
  • Carbon
Comment As of August 2018, Pt has not yet been deposited in the Temescal.

Please contact the Thin Film group to develop a process.

* If depositing a total of more than 600 nm, please write to metal@danchip.dtu.dk well in advance to ensure that enough material is present.

Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Platinum&oldid=39196"