Specific Process Knowledge/Thin film deposition/Deposition of Chromium

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Chromium deposition

Chromium can be deposited by e-beam evaporation and sputter deposition. It should be noted that in e-beam evaporation, chromium does not melt but evaporates directly from the solid phase. In the chart below you can compare the different deposition equipment.



E-beam evaporation (Temescal) E-beam evaporation (Wordentec) E-beam evaporation (Physimeca) Sputter deposition (Lesker sputterer)
General description E-beam deposition of Chromium E-beam and sputter deposition of Chromium E-beam deposition of Chromium Sputter deposition of Chromium
Pre-clean Ar ion bombardment RF Ar clean RF Ar clean
Layer thickness 10Å to 1µm* 10Å to 1µm* 10Å to 1000 Å at least up to 200 nm
Deposition rate 0.5Å/s to 10Å/s 10Å/s to 15Å/s (e-beam)

Sputtering: Depends on process parameters. See process log.

10Å/s Depends on process parameters. See process log.
Batch size
  • 4x6" wafers or
  • 3x8" wafers (ask for holder)
  • Many smaller pieces
  • 24x2" wafers or
  • 6x4" wafers or
  • 6x6" wafers
  • 1x 2" wafer or
  • 1x 4" wafers or
  • Several smaller pieces
  • 1x6" wafers
  • Smaller pieces/wafers
Allowed substrates
  • Silicon wafers
  • Quartz wafers
  • Pyrex wafers
  • Silicon wafers
  • Quartz wafers
  • Pyrex wafers
  • III-V materials
  • Silicon wafers
  • Quartz wafers
  • Pyrex wafers
  • Silicon wafers
  • and almost any other
Allowed materials
  • Silicon
  • Silicon oxide
  • Silicon nitride
  • Silicon (oxy)nitride
  • Photoresist
  • PMMA
  • Mylar
  • SU-8
  • Silicon oxide
  • Silicon (oxy)nitride
  • Photoresist
  • PMMA
  • Mylar
  • almost any
Comment

* For thicknesses above 600 nm, request permission from metal@danchip.dtu.dk to ensure there is enough material.

Studies of Cr deposition processes

Uniformity of Cr layers - Uniformity of Cr layers deposited with different methods and settings

Sputtering of Cr in Wordentec- Settings and deposition rates