Specific Process Knowledge/Back-end processing/Polishing machine
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Polisher/Lapper
The Logitech Orbis Polisher (CMP) is for polishing wafers (removing material in the nm range) it is not for thinning down wafers or other substrates.
The user manual, user APV, technical information and contact information can be found in LabManager:
The Logitech PM5 Polisher/Lapper in LabManager
Equipment | Polisher/Lapper | |
---|---|---|
Purpose |
Thinning of substrates of |
|
Performance | Thinning |
|
Polishing |
| |
Process parameter range | Polishing liquid |
|
Polishing cloths |
| |
Rotation speed |
| |
Arm sweep |
| |
Substrates | Batch size |
|
Allowed materials |
|