Specific Process Knowledge/Bonding

From LabAdviser

Choose bonding method

Comparing the three bonding methods in the EVG NIL

. Eutectic bonding Fusion bonding Anodic bonding
General description For bonding two substrates by use of an interphase that makes an eutecticum. For bonding two identical materials. For bonding Si and Glass.
Bonding temperature Depending on the eutecticum 310Failed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle ^o} C to 400Failed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle ^o} C. Depending on defects 50Failed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle ^o} C to 400Failed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle ^o} C. Depending on the voltage 300Failed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle ^o} C to 500Failed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle ^o} C Standard is 400Failed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle ^o} C.
Annnealing temperature No annealing 1000Failed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle ^o} C in the bond furnace C3 No annealing
Materials possible to bond Bonding of substrates is done by use of the eutectica Au/Si, Au/Sn and Ni/Si Si/Si, SiOFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} /SiOFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} Si/Pyrex (glass)
Substrate size Up to 6" (aligning only possible for 4" and 6") Up to 6" (aligning only possible for 4" and 6") Up to 6" (aligning only possible for 4" and 6")
Cleaning Cleaning by N2. Wet chemical cleaning, IMEC. Cleaning by N2.

Choose equipment

  • Speedline manual spinner - For spinning of PMMA and Topas
  • EVG NIL