Specific Process Knowledge/Characterization/SEM Supra 3

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The SEM Supra 3

The user manuals, quality control procedures and results, user APVs, technical information and contact information can be found in LabManager:

SEM's at DTU Danchip:

• The SEM Leo page in LabManager,
• The SEM Supra 1 page in LabManager,
• The SEM Supra 2 page in LabManager,
• The SEM Supra 3 page in LabManager,

Equipment performance and process related parameters

Equipment		SEM Supra 2 (Supra 60VP SEM)
Purpose	Imaging and measurement of	Any sample except bulk insulators such as polymers, glass or quartz wafers
Location		Cleanroom of DTU Danchip
Performance	Resolution	1-2 nm (limited by vibrations) The resolution is strongly dependent on the type of sample and the skills of the operator.
Instrument specifics	Detectors	Secondary electron (Se2) Inlens secondary electron (Inlens) 4 Quadrant Backscatter electron (QBSD) Variable pressure secondary electron (VPSE)
	Stage	X, Y: 150 × 150 mm T: -10 to 70o R: 360o Z: 50 mm
	Electron source	FEG (Field Emission Gun) source
	Operating pressures	Fixed at High vacuum (2 × 10-4mbar - 10-6mbar) Variable at Low vacuum (0.1 mbar - 2 mbar)
	Options	Antivibration platform Fjeld M-200 airlock taking up to 8" wafers Oxford Instruments X-MaxN 50 mm2 SDD EDX detector and AZtec software package
Substrates	Batch size	Up to 8" wafer with 6" view
	Allowed materials	Any standard cleanroom material