Specific Process Knowledge/Wafer cleaning/cleaning with HF
Is in use during the RCA procedure. This bath must only be used in the RCA procedure or to remove native oxide on new wafers from the box. See the RCA page for further details.
Is in use during the RCA procedure. This bath must only be used in the RCA procedure or to remove native oxide on new wafers from the box. See the RCA page for further details.