Specific Process Knowledge/Back-end processing/Disco Saw

Disco Automatic dicing saw, model DAD321

The dicer feature versatile processing capabilities, compact designs, and high precision and reliability. Users perform workpiece loading, alignment, and unloading manually.

The dicer at DANCHIP is placed in room ?? on the first floor in bldg. 346. Please notice that this is not a cleanroom and that the dicingproces is very dirty. Think about how to clean your samples if you want to bring them back in the cleanroom.

The dicer can handle up to 6” wafers and 160x160 mm square samples and has a 192 mm cutting range.

A rough overview of the performance Disco DAD321 Dicer

Purpose	Equipment for dicing out samples.	Single point profiles Wafer mapping Stress measurements by measuring wafer bow Surface roughness on a line scan
Performance	Scan range xy	Line scan x: 50 µm to 200 mm
.	Scan range z	50 Å to 262 µm
.	Resolution xy	down to 0.067 µm
.	Resolution z	1Å, 10Å or 20Å
.	Max. scan depth as a function of trench width W	1.2(W[µm]-5µm)
Hardware settings	Tip radius	5 µm 45^o cone
Substrates	Substrate size	up to 8"
.	Substrate material allowed	In principle all materials