Specific Process Knowledge/Lithography/Baking

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Comparing baking methods

HMDS Buffered HF-Clean Oven 250C
Generel description

Vapor priming

Native oxide strip

Dehydration

Temperature

hexamethyldisilazane (HMDS)

12%HF with Ammoniumflouride

none

Substrate size
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 100 mm wafers
  • 100 mm wafers
  • 150 mm wafers
Allowed materials

Silicon, glass, and polymer substrates

Film or pattern of all types

  • Silicon
  • Poly Silicon
  • Silicon Oxide
  • Silicon Nitride
  • Silicon Oxynitride
  • Photoresist
  • Blue film
  • Silicon
  • Silicon Oxide
  • Silicon Nitride
  • Glass
Restrictions Type IV and resist/polymer on polymer substrate Wafers with metal is not allowed Resist is not allowed


Hotplates

Fumehood hotplate

Right: Hotplate 90 °C situated in C-1

Variable temperature hotplate mostly used for baking of single wafers as a soft baking step after a spin coating of photoresist.

Hotplate: 90-110C

Location of Hotplate: 90-110C in C-1

Hotplate: 90-110C is used for baking of 2" - 6" wafers.

The user manual, and contact information can be found in LabManager: Hotplate: 90-110C


SU8 hotplates

Hotplate 1 (SU8) and Hotplate 2 (SU8) situated in C-1

We have two dedicated SU-8 hotplates in C-1.

Users can control the ramp-time, the baking temperature, and the baking time.

The user manual, and contact information can be found in LabManager: Hotplate 1 (SU8) Hotplate 2 (SU8)

Ovens

Oven 90C

Oven 90 °C: positioned in C-1

The oven is mostly used for baking of several wafers at a time at 90 °C as a soft baking step after a spin coating of photoresist. For 1.5µm resist the baking time is 30 min. For most of the other resist thicknesses it is also 30 min.

The user manual, and contact information can be found in LabManager: Oven 90C


Oven 250C for pretreatment

Oven 250C for pretreatment: positioned in C-1

Oven 250C

Oven: 120C - 250C

The user manual, and contact information can be found in LabManager: Oven: 120C - 250C