Specific Process Knowledge/Thin film deposition/Deposition of Palladium

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Palladium can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.


E-beam evaporation (Alcatel) E-beam evaporation (Physimeca)
General description E-beam deposition of Pd E-beam deposition of Pd
Pre-clean RF Ar clean
Layer thickness 10Å to 3000Å* 10Å to 2000Å
Deposition rate 2Å/s to 10Å/s 2Å/s to 10Å/s
Batch size
  • Up to 1x4" wafers
  • smaller pieces
  • 1x 2" wafer or
  • 1x 4" wafers or
  • Several smaller pieces
Allowed materials
  • Silicon oxide
  • Silicon (oxy)nitride
  • Photoresist
  • PMMA
  • Mylar
  • SU-8
  • Metals
  • Silicon oxide
  • Silicon (oxy)nitride
  • Photoresist
  • PMMA
  • Mylar
Comment

* For thicknesses above 200 nm permission is requested.

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