Specific Process Knowledge/Lithography/Espacer
We have Espacer in stock and approved for use in the cleanroom. You can find a guideline for a process flow here: Process Flow CSAR+ESPACER.docx. Technical information of Espacer can be found here: Espacer_300_Technical_Info.pdf, Espacer_catalog.pdf.
Please contact Lithography if you wish to test this material.
| Process | No ESPACER | ESPACER |
|---|---|---|
| Resist | Borofloat 4" wafers (JB456), no pretreatment | |
| Resist | AR-P 6200/2 AllResist E-beam resist | |
| Spin Coat | 1 min @ 4000 rpm, softbake 2 min @ 150 degC, thickness ~140nm | |
| ESPACER | 1 min @ 2000 rpm (no softbake), Manual Spinner 1 (Laurell) | |
| E-beam exposure | 2 nA, aperture 5, dose 150-310 muC/cm2, SHOT (A,10) | |
| Rinse | Rinsed with hand shower in fumehood, dried with N2 gun | |
| Developing | SX-AR 600-54/6 60 sec, 60 sec IPA rinse | |
| Characterization | Nikon ECLIPSE optical microscope, E-5 | |
| All doses | 
|
|
| 230 muC/cm2 | 
|
|
| 219 muC/cm2 | 
|
|
| Sputter Coated | <10nm Pt at DTU CEN | |
| Characterization | Zeiss SEM supra 60VP, D-2 | |
| 230 muC/cm2 | 
| |