Specific Process Knowledge/Thin film deposition/Deposition of TiW
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Deposition of TiW alloy can be done in the Wordentec.
Sputtering of TiW
| Sputter deposition (Wordentec) | |
|---|---|
| General description | Sputter deposition of TiW |
| Pre-clean | RF Ar clean |
| Layer thickness | . |
| Deposition rate | Depending on process parameters, see here. |
| Batch size |
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| Allowed substrates |
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| Allowed materials |
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| Comments | TiW alloy: 10%/90% by weight |
Deposited rates
This is done by a sputtering process. Process parameters (argon pressure and effect) can be varied, the surface roughness and the deposition rate (see here) and may change with these settings.
Deposited film characteristics
AFM pictures show how the surface roughness is dependent of the process parameters, this can be seen here.