Specific Process Knowledge/Thin film deposition/Deposition of Tungsten
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Tungsten (W) can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
E-beam evaporation (Alcatel) | |
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General description | E-beam evaporation of W |
Pre-clean | RF Ar clean |
Layer thickness | 10Å to 5000Å* |
Deposition rate | 2Å/s to 15Å/s |
Batch size |
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Allowed materials |
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Comments |
* For thicknesses above 200 nm permission is required