Specific Process Knowledge/Thin film deposition/Deposition of Tin

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Tin can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.

	E-beam evaporation (Alcatel)
General description	E-beam deposition of Sn
Pre-clean	RF Ar clean
Layer thickness	10Å to 1µm*
Deposition rate	2Å/s to 15Å/s
Pre-clean	RF Ar clean
Batch size	Up to 1x4" wafers smaller pieces
Allowed materials	Silicon Silicon oxide Silicon (oxy)nitride Photoresist PMMA Mylar SU-8 Metals
Comment

* For thicknesses above 200 nm permission is required.