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Die bonder (eutectic metal soldering)
The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.
The user manuals, user APVs, technical information and contact information can be found in LabManager:
The Die-bonder Cammax EDB-80
Die Bonder in LabManager
Process information
Flip-chip bonder (glue attachment)
The Flip chip bonder
Flip-chip Bonder in LabManager
Equipment performance and process related parameters
| Equipment
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Die bonder
|
Flip-chip bonder
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| Purpose
|
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- Fine placement of dies
- Eutectic metal soldering
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- Fine placement of dies
- glue attachment
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| Performance
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- Low thermal resistance
- Always conducting
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- Medium or High thermal resistance
- Possibility of both conducting and isolating adhesives
- If an epoxy based adhesive is used the user is required to have the epoxy course.
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| Substrates
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Allowed materials
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- Should be able to withstand the soldering temperature
- Typical materials are: Alumina (Al2O3), AluminumNitride (AlN)
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- Any that is compatible with the glue used
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