Specific Process Knowledge/Thin film deposition/Deposition of NiV

NickelVanadium can be deposited by sputter evaporation. In the chart below you can compare the different deposition equipment.

	Sputter deposition (PVD co-sputter/evaporation)	Sputter deposition (Sputter-System Lesker)
Batch size	12x2" wafers or 12x4" wafers or 4x6" wafers	1x4" wafer or 1x6" wafer
Pre-clean	RF Ar clean
Layer thickness	About 10Å to 4000Å	.
Deposition rate	Depending on process parameters.	Depending on process parameters.
Allowed materials	Silicon oxide Silicon (oxy)nitride Photoresist PMMA Mylar SU-8 Metals	Silicon wafers
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