Specific Process Knowledge/Back-end processing

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Choose an equipment

• Chip/die mounting
  • Die Bonder (eutectic metal)
  • Flip-chip Bonder (glue)
• Wire bonding
  • TPT Wire Bonder
  • Ball Wire Bonder
• Wafer dicing/machining
  • Polisher/Lapper machine
  • Wafer Scriber
  • Disco Saw
  • Laser Micromachining Tool
  • Sandblasting (at DTU Nanotech). Sandblasting is a very fast way of structuring glass and can be used for e.g. making inlet holes in glass substrates for microfluidic devices
• Molding
  • Polymer Injection Molder