Specific Process Knowledge/Back-end processing

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Choose an equipment

• Die Bonder (eutectic metal)
• Flip-chip Bonder (glue)
• TPT Wire Bonder
• Ball Wire Bonder
• Wafer Scriber
• Disco Saw
• Polymer Injection Molder
• Polisher/Lapper machine
• Laser Micromachining Tool
• Sandblasting (at DTU Nanotech). Sandblasting is a very fast way of structuring glass and can be used for e.g. making inlet holes in glass substrates for microfluidic devices