Specific Process Knowledge/Etch/Wet Aluminium Etch: Difference between revisions
Appearance
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! Aluminium Etch 2 | ! Aluminium Etch 2 | ||
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!General description | !General description | ||
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|Etch of aluminium + 1.5% Si | |Etch of aluminium + 1.5% Si | ||
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!Link to safety APV and KBA | !Link to safety APV and KBA | ||
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[http://kemibrug.dk/KBA/CAS/106779/?show_KBA=1&portaldesign=1 see KBA here] | [http://kemibrug.dk/KBA/CAS/106779/?show_KBA=1&portaldesign=1 see KBA here] | ||
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!Chemical solution | !Chemical solution | ||
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4 vol% HNO<sub>3</sub> 70% | 4 vol% HNO<sub>3</sub> 70% | ||
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!Process temperature! | |||
|50 <sup>o</sup>C | |50 <sup>o</sup>C | ||
|20 <sup>o</sup>C | |20 <sup>o</sup>C | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
!Possible masking materials! | |||
|Photoresist (1.5 µm AZ5214E) | |Photoresist (1.5 µm AZ5214E) | ||
|Photoresist (1.5 µm AZ5214E) | |Photoresist (1.5 µm AZ5214E) | ||
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|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
!Etch rate | |||
|~100 nm/min (Pure Al) | |~100 nm/min (Pure Al) | ||
|~60 nm/min | |~60 nm/min | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
!Batch size! | |||
|1-25 wafers at a time | |1-25 wafers at a time | ||
|1-25 wafer at a time | |1-25 wafer at a time | ||
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|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
!Size of substrate | |||
|4" wafers | |4" wafers | ||
|4" wafers | |4" wafers | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
!Allowed materials | |||
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*Aluminium | *Aluminium | ||