Specific Process Knowledge/Etch/ASE (Advanced Silicon Etch): Difference between revisions
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* '''Deepetch''': The deep etch process will etch a 50 <math>\mu</math>m opening down to make a 300 <math>\mu</math>m trench. | * '''Deepetch''': The deep etch process will etch a 50 <math>\mu</math>m opening down to make a 300 <math>\mu</math>m trench. | ||
The standardization procedure on the ASE covers these two etches. | |||