Specific Process Knowledge/Back-end processing/Polymer Injection Molder: Difference between revisions

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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/... click here]'''
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/Polymer_Injection_Molder click here]'''
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== Technotrans microform.200 ==
== Polymer injection molding ==


The Technotrans microform.200 (Electroplating-Ni in LabManager) is a machine capable of depositing nickel electrochemically. This is done by lowering the sample into an electrolyte containing nickel ions and then apply a voltage across the sample and the anode. The anode is a basket filled with nickel pellets. The cathode is the sample to be coated with nickel.
The injection molder at Danchip is an Engel Victory Tech 80/45. It is hydraulic machine capable of up to 450 kN of clamping force.
 
At the anode metallic nickel is oxidized to nickel ions:
Ni (s) &rArr; Ni<sup>2+</sup> (aq) + 2 e<sup>-</sup>
At the cathode (the sample surface), nickel ions from solution are reduced to metallic nickel:
Ni<sup>2+</sup> (aq) + 2 e<sup>-</sup> &rArr; Ni (s)
The minimal charge accepted by the software on the machine is 0.1 Ah (Ampere-hours). This corresponds to roughly 2 µm of nickel on a four inch wafer. You can abort a program prematurely to achieve even lower thicknesses, but this requires manual control of the machine.
The maximum allowed thickness is ~1,4 mm (1400 µm), since higher a thickness will make the release of the sample difficult. This corresponds to a charge of 53-54 Ah on a four inch wafer.
The plating bath is an aqueous solution of nickel sulphamate, boric acid and sulfamic acid. The bath is moderately acidic (pH = 3,5 - 3,8) and the temperature of the bath is 51-52°C. The sample will spin at 60 RPM during deposition.
   
   
Uniformity across a 4" wafer is around 5% for the standard processes (the edge being slightly thicker than the center of the sample). Running at high current densities will deposit a nickel layer that is quite soft. Decreasing current density will increase tensile strength of the deposited nickel.
'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:'''  
'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:'''  
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[[image:choi_2017_Machine_overview.jpg|200x200px|right|thumb|Electroplating-Ni positioned in cleanroom 1]]
[[image:Imm.jpg|200x200px|right|thumb|Injection molding machine in the basement under the cleanroom]]


<!-- give the link to the equipment info page in LabManager: -->
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[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=274 Electroplating-Ni Info on LabManager]
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=278 Polymer injection molding Info on LabManager]


== Process information ==
== Process information ==

Revision as of 14:19, 28 May 2013

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Polymer injection molding

The injection molder at Danchip is an Engel Victory Tech 80/45. It is hydraulic machine capable of up to 450 kN of clamping force.

The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:

Injection molding machine in the basement under the cleanroom

Polymer injection molding Info on LabManager

Process information

Equipment performance and process related parameters

Parameter Value
Sample dimensions Diameter

50, 100 or 150 mm (~ 2", 4" or 6")

Sample thickness

Maximum 1,0 mm

Process parameters Temperature

52*C

pH

3,5 - 3,8

Sample requirements Seed metal

100 nm of either NiV, Ti+Au or Cr+Au recommended. Most commonly seed metals are sputtered using the Sputter-System(Lesker).

Allowed materials

Most materials allowed. See below.

Forbidden materials

Copper, cobalt. See machine manual on LabManager for details


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