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Specific Process Knowledge/Thin film deposition/Electroplating-Ni: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, danchip
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DCH-Employees-701, NLAB-Employees-701, danchip
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{| border="2" cellspacing="0" cellpadding="2"  
{| border="2" cellspacing="0" cellpadding="2"  


!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Parameter
|style="background:WhiteSmoke; color:black"|<b>Equipment 1</b>
|style="background:WhiteSmoke; color:black"|<b>Value</b>
|-
|-
!style="background:silver; color:black;" align="center" width="60"|Purpose
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Sample dimensions
|style="background:LightGrey; color:black"|  
|style="background:LightGrey; color:black"|Diameter
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Purpose 1
50, 100 or 150 mm (~ 2", 4" or 6")
*Purpose 2
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
|style="background:LightGrey; color:black"|Response 1
|style="background:WhiteSmoke; color:black"|
*Performance range 1
*Performance range 2


|-
|-
|style="background:LightGrey; color:black"|Response 2
|style="background:LightGrey; color:black"|Sample thickness
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Performance range
Maximum 1,0 mm


|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
|style="background:LightGrey; color:black"|Parameter 1
|style="background:LightGrey; color:black"|Temperature
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Range
52*C
|-
|-
|style="background:LightGrey; color:black"|Parameter 2
|style="background:LightGrey; color:black"|pH
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Range
3,5 - 3,8
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Sample requirements
|style="background:LightGrey; color:black"|Batch size
|style="background:LightGrey; color:black"|Seed metal
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*<nowiki>#</nowiki> 50 mm wafer
100 nm of either NiV, Ti+Au or Cr+Au recommended
*<nowiki>#</nowiki> 100 mm wafer
*<nowiki>#</nowiki> 150 mm wafer
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Allowed material 1
Most materials allowed. See below.
*Allowed material 2
|-  
|-  
| style="background:LightGrey; color:black"|Forbidden materials
|style="background:WhiteSmoke; color:black"|
Copper, cobalt. See machine manual on LabManager for details
|}
|}
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