Specific Process Knowledge/Etch/DRIE-Pegasus/processA: Difference between revisions
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== Process A guidelines == | == Process A guidelines == | ||
Process A is optimized for speed and depending on feature size and etch load it will | Process A is optimized for speed and depending on feature size and etch load it will achieve etch rates up to 25-30 µm/min. | ||
This aggressive etch has a few drawbacks. The | |||
== Process A performance == | == Process A performance == | ||