Specific Process Knowledge/Thin film deposition/Electroplating-Ni: Difference between revisions
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|style="background:LightGrey; color:black"|Batch size | |style="background:LightGrey; color:black"|Batch size | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*<nowiki>#</nowiki> 50 mm wafer | |||
*<nowiki>#</nowiki> 50 mm | *<nowiki>#</nowiki> 100 mm wafer | ||
*<nowiki>#</nowiki> 100 mm | *<nowiki>#</nowiki> 150 mm wafer | ||
*<nowiki>#</nowiki> 150 mm | |||
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| style="background:LightGrey; color:black"|Allowed materials | | style="background:LightGrey; color:black"|Allowed materials |
Revision as of 13:00, 8 May 2013
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Name of equipment
Write a short description of the equipment(s).
The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:
Process information
Link to process pages - e.g. one page for each material
Example:
Equipment | Equipment 1 | |
---|---|---|
Purpose |
| |
Performance | Response 1 |
|
Response 2 |
| |
Process parameter range | Parameter 1 |
|
Parameter 2 |
| |
Substrates | Batch size |
|
Allowed materials |
|