Specific Process Knowledge/Thin film deposition/Electroplating-Ni: Difference between revisions
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range | !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range | ||
|style="background:LightGrey; color:black"|Parameter 1 | |style="background:LightGrey; color:black"|Parameter 1 | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Range | *Range | ||
|- | |- | ||
|style="background:LightGrey; color:black"|Parameter 2 | |style="background:LightGrey; color:black"|Parameter 2 | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Range | *Range | ||
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*<nowiki>#</nowiki> 100 mm wafers | *<nowiki>#</nowiki> 100 mm wafers | ||
*<nowiki>#</nowiki> 150 mm wafers | *<nowiki>#</nowiki> 150 mm wafers | ||
|- | |- | ||
| style="background:LightGrey; color:black"|Allowed materials | | style="background:LightGrey; color:black"|Allowed materials | ||
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*Allowed material 1 | *Allowed material 1 | ||
*Allowed material 2 | *Allowed material 2 | ||
|- | |- | ||
|} | |} | ||
<br clear="all" /> | <br clear="all" /> | ||