Specific Process Knowledge/Thin film deposition/Deposition of Nickel: Difference between revisions
| Line 26: | Line 26: | ||
*12x4" wafers or | *12x4" wafers or | ||
*4x6" wafers | *4x6" wafers | ||
| | |||
*1x2" wafer or | |||
*1x4" wafer or | |||
*1x6" wafer | |||
|- | |- | ||
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|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
|None | |||
|- | |- | ||
| Line 38: | Line 43: | ||
|10Å to 1 µm | |10Å to 1 µm | ||
|10Å to 1000 Å | |10Å to 1000 Å | ||
|A few µm to 1500 µm | |||
|- | |- | ||
| Deposition rate | | Deposition rate | ||
| Line 43: | Line 50: | ||
|10Å/s to 15Å/s | |10Å/s to 15Å/s | ||
|About 1Å/s | |About 1Å/s | ||
|About 1 - 1400Å/s | |||
|- | |- | ||
|- | |- | ||