Specific Process Knowledge/Thin film deposition/Electroplating-Ni: Difference between revisions
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[[image: | [[image:choi_2017_Machine_overview.jpg|200x200px|right|thumb|Electroplating-Ni positioned in cleanroom 1]] | ||
<!-- give the link to the equipment info page in LabManager: --> | <!-- give the link to the equipment info page in LabManager: --> | ||
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach= | [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=274 LabManager] | ||
== Process information == | == Process information == | ||
Revision as of 13:31, 7 May 2013
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Name of equipment
Write a short description of the equipment(s).
The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:
Process information
Link to process pages - e.g. one page for each material
Example:
- Etch of silicon using RIE
- Etch of silicon oxide using RIE
- Etch of silicon nitride using RIE
- Etch of photo resist using RIE
| Equipment | Equipment 1 | Equipment 2 | |
|---|---|---|---|
| Purpose |
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| Performance | Response 1 |
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| Response 2 |
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| Process parameter range | Parameter 1 |
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| Parameter 2 |
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| Substrates | Batch size |
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| Allowed materials |
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