Specific Process Knowledge/Back-end processing: Difference between revisions
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*[[/Flip-chip Bonder|Flip-chip Bonder (glue)]] | *[[/Flip-chip Bonder|Flip-chip Bonder (glue)]] | ||
*[[/Wire Bonder|TPT Wire Bonder]] | *[[/Wire Bonder|TPT Wire Bonder]] | ||
*[[/Ball Wire Bonder|Ball Wire Bonder]] | *[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]] | ||
*[[/Wafer Scriber|Wafer Scriber]] | *[[/Wafer Scriber|Wafer Scriber]] | ||
*[[/Disco Saw|Disco Saw]] | *[[/Disco Saw|Disco Saw]] | ||
Revision as of 15:55, 6 May 2013
Choose an equipment
- Die Bonder (eutectic metal)
- Flip-chip Bonder (glue)
- TPT Wire Bonder
- Ball Wire Bonder
- Wafer Scriber
- Disco Saw
- Polymer Injection Molder
- Polisher/Lapper machine
- Laser Micromachining Tool
- Sandblasting (at DTU Nanotech). Sandblasting is a very fast way of structuring glass and can be used for e.g. making inlet holes in glass substrates for microfluidic devices