Specific Process Knowledge/Back-end processing/Wire Bonder: Difference between revisions
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==TPT Wire Bonder== | ==TPT Wire Bonder== | ||
The TPT Wire Bonder is | The TPT Wire Bonder is bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder. | ||
'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:''' | '''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:''' | ||
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[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=238 TPT Wire Bonder] | [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=238 TPT Wire Bonder] | ||
==Ball Wire Bonder K&S 4524== | |||
The Ball Wire Bonder K&S 4524 is for high precision ball bonding. It is a semi-automatic wire bonder with good control of bond placement and bonding parameters. | |||
'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:''' | |||
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[[Image:K&S_4524_ball_wire-bonder.jpg|300x300px|thumb|The Ball Wire Bonder K&S 4524]] | |||
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[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=0 Ball Wire Bonder (not there yet!)] | |||
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