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| ==Overview: Wet HF-etch of bulk glass==
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| {| border="2" cellspacing="0" cellpadding="4" align="center"
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| !
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| ! Fused silica
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| ! Borofloat glass
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| |- valign="top"
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| |'''General description'''
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| *40% pre-mixed HF
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| *40% pre-mixed HF
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| |-valign="top"
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| |'''Possible masking materials'''
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| *[[Specific Process Knowledge/Thin film deposition/Deposition of Silicon|LPCVD silicon]] (good adhesion and step coverage)
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| *[[Specific Process Knowledge/Thin film deposition/Deposition of Silicon|Sputtered silicon (Alcatel)]] (bad adhesion and step coverage)
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| *We are testing other masks at the moment (ask BGE)
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| |- valign="top"
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| |'''Etch rate'''
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| *~700 nm/min (patterned silica, slow stirring)
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| *~800 nm/min (non-patterned silica, slow stirring)
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| *~3.9 µm/min
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| |-valign="top"
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| |'''Uniformity'''
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| *~ 2% (slow stirring, horizontal wafer)
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| *
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| |-valign="top"
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| |'''Batch size'''
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| *1 wafers at a time
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| *1 wafer at a time
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| |-valign="top"
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| |'''Size of substrate'''
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| *4" wafers
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| *4" wafers
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| |-valign="top"
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| |'''Allowed materials'''
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| *No restrictions
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| *No restrictions
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| |-
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| |}
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| = This section is under construction [[Image:section under construction.jpg|70px]]= | | = This section is under construction [[Image:section under construction.jpg|70px]]= |
