Specific Process Knowledge/Etch/Etching of Bulk Glass: Difference between revisions
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*40% pre-mixed HF | *40% pre-mixed HF | ||
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|'''Possible masking materials''' | |'''Possible masking materials''' | ||
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*[[Specific Process Knowledge/Thin film deposition/Deposition of Silicon|Sputtered silicon (Alcatel)]] (bad adhesion and step coverage) | *[[Specific Process Knowledge/Thin film deposition/Deposition of Silicon|Sputtered silicon (Alcatel)]] (bad adhesion and step coverage) | ||
*We are testing other masks at the moment (ask BGE) | *We are testing other masks at the moment (ask BGE) | ||
|- valign="top" | |- valign="top" | ||
|'''Etch rate''' | |'''Etch rate''' | ||
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*~3.9 µm/min | *~3.9 µm/min | ||
|-valign="top" | |-valign="top" | ||
|'''Uniformity''' | |'''Uniformity''' | ||
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* | * | ||
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*1 wafer at a time | *1 wafer at a time | ||
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|'''Size of substrate''' | |'''Size of substrate''' | ||
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*4" wafers | *4" wafers | ||
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|'''Allowed materials''' | |'''Allowed materials''' | ||
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*No restrictions | *No restrictions | ||
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|} | |} | ||