Specific Process Knowledge/Characterization/KLA-Tencor Surfscan 6420: Difference between revisions
| Line 51: | Line 51: | ||
|style="background:LightGrey; color:black"|Batch size | |style="background:LightGrey; color:black"|Batch size | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Small wafer pieces can all be used | |||
*1-25 100 mm wafers | *1-25 100 mm wafers | ||
*1-25 150 mm wafers | *1-25 150 mm wafers | ||
*1-25 200 mm wafers | |||
|- | |- | ||
| style="background:LightGrey; color:black"|Substrate material allowed | | style="background:LightGrey; color:black"|Substrate material allowed | ||