Specific Process Knowledge/Characterization/KLA-Tencor Surfscan 6420: Difference between revisions

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*Particles counting
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!style="background:silver; color:black" align="center" rowspan="3"|Performance
|style="background:LightGrey; color:black"|Particles size
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*0.1 µm to 3 µm
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|style="background:LightGrey; color:black"|Througput
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*Up to 100 wafer per hour (200 mm)
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!style="background:silver; color:black" align="center"|Performance
|style="background:LightGrey; color:black"|Repeatbility
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*Within  1%, 1σ (mean count > 500, 0,204 µm diameter latex spheres)
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
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| style="background:LightGrey; color:black"|Substrate material allowed
| style="background:LightGrey; color:black"|Substrate material allowed
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*Silicon wafers (new or RCA cleaned wafers)
 
*From A2 furnace directly (e.g. incl. Predep HF)
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Revision as of 12:32, 23 April 2013

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KLA-Tencor Surfscan 6420

The image is from the cleanroom at the place it was refurbish in California.

Particles counting of a unpatterned surface. A broad range of particles size from 0.1 µm to greater than 3 µm can be measured on a polished silicon or epitaxial layers. Thin films as e.g. Poly-si, Nitride and thermal Oxide can also be inspected. The system will remove small surface roughness so it not count as a particle.


The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:

LabManager

Overview of the performance of the Surfscan 6420 and some process related parameters

Purpose
  • Particles counting
Performance Particles size
  • 0.1 µm to 3 µm
Througput
  • Up to 100 wafer per hour (200 mm)
Repeatbility
  • Within 1%, 1σ (mean count > 500, 0,204 µm diameter latex spheres)
Process parameter range Process Temperature
  • Room temperature
Process pressure
  • 1 atm
Substrates Batch size
  • 1-25 100 mm wafers
  • 1-25 150 mm wafers
Substrate material allowed
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