Jump to content

Specific Process Knowledge/Characterization/KLA-Tencor Surfscan 6420: Difference between revisions

From LabAdviser
← Older editNewer edit →
VisualWikitext
Mdyma (talk | contribs)
danchip
584 edits
Mdyma (talk | contribs)
danchip
584 edits
Line 24: Line 24:


|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
 
*Particles counting
|-
!style="background:silver; color:black" align="center" rowspan="3"|Performance
|style="background:LightGrey; color:black"|Particles size
|style="background:WhiteSmoke; color:black"|
*0.1 µm to 3 µm
|-
|style="background:LightGrey; color:black"|Througput
|style="background:WhiteSmoke; color:black"|
*Up to 100 wafer per hour (200 mm)
|-
|-
!style="background:silver; color:black" align="center"|Performance
|style="background:LightGrey; color:black"|Repeatbility
|style="background:LightGrey; color:black"| ||style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
 
*Within  1%, 1σ (mean count > 500, 0,204 µm diameter latex spheres)
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
Line 47: Line 56:
| style="background:LightGrey; color:black"|Substrate material allowed
| style="background:LightGrey; color:black"|Substrate material allowed
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Silicon wafers (new or RCA cleaned wafers)
 
*From A2 furnace directly (e.g. incl. Predep HF)
|-  
|-  
|}
|}

Revision as of 11:32, 23 April 2013

THIS PAGE IS UNDER CONSTRUCTION

Feedback to this page: click here

KLA-Tencor Surfscan 6420

The image is from the cleanroom at the place it was refurbish in California.

Particles counting of a unpatterned surface. A broad range of particles size from 0.1 µm to greater than 3 µm can be measured on a polished silicon or epitaxial layers. Thin films as e.g. Poly-si, Nitride and thermal Oxide can also be inspected. The system will remove small surface roughness so it not count as a particle.


The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:

LabManager

Overview of the performance of the Surfscan 6420 and some process related parameters

Purpose
  • Particles counting
Performance Particles size
  • 0.1 µm to 3 µm
Througput
  • Up to 100 wafer per hour (200 mm)
Repeatbility
  • Within 1%, 1σ (mean count > 500, 0,204 µm diameter latex spheres)
Process parameter range Process Temperature
  • Room temperature
Process pressure
  • 1 atm
Substrates Batch size
  • 1-25 100 mm wafers
  • 1-25 150 mm wafers
Substrate material allowed
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Characterization/KLA-Tencor_Surfscan_6420&oldid=9728"